How semiconductors prepared?

Question

For semiconductor purpose what they are mostly using like principles, operation, Technology,Methodology,Equipments be used ?

Answer 1

The process is very involved!!

These days most fabs are closed systems because of the delicate process.

It takes about 8-12 major steps to make a chip. Keywords you should look up are etching, photo lithography, resist, dopant layers, wafer processing, silicon fab sustaining, etc..

Below is an general white paper on how to make a chip. Enjoy!

Answer 2

Specifics (i.e. temp, pressure, flows, etc) are major trade secrets closely guarded by Intel, IBM, etc.

In general, the process is this.

1st they make a base from insulating material (si, for example)

2, they place a lattice on top of it & introduce conducting materials (Ge) that adhere to the surface of the base & lattice.

3, lattice is removed, leaving a network of "wires" on the Si surface. Those "wires" a extremely thin, ~x1000 thinner then a human hair. This system of "wires" is an electronic circuit.

4, next is another layer of insulator, Si

And then they just repeat steps 2-4 many-many times.