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What are the stages in the manufacturing of integrated circuits?

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plss. elaborate further

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  1. 1. Raw wafer manufacturing.  Growing pure silicon crystal inngots  in a crystal oven.

    2. Slicing the ingot into thin wafers

    3. Doping the wafers with donor or acceptor atoms to create P or N-type silicon.  This is also done in an oven.

    4. Masking the silicon and bombarding the unmasked portions with dopants to create indivudual N and P-type regions

    5. repeating step 4 with a different mask to create yet more N and P-type regions, to start to form indiviual transistors.

    6. Masking the silicon and etching portions of the material away to create trenches in the material to isolate the transistors.

    7. Masking and adding insulating material (i.e. silicon dioxide) to isolate the sides and tops of the transistors.

    8. Masking and adding metals to make interconnections between transistors,

    9. Repeating steps 6, 7, and 8 to create complex circuits on the wafer.

    10. Inspection and testing of the circuits

    11. Cutting individual IC chips from the larger wafer (sometimes there are 100s of identical ICs made on one wafer at-a-time).

    12. More inspection and testing of individual IC chips.

    13. placing the chips into their packages

    14. connecting wires from the pads on the chip to the wires of the package

    15. final tests of the complete IC.

    .

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